Here is the abstract you requested from the Thermal_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Development of Heat Pipe Loop Technology for Electronics Cooling|
|Keywords: Heat Pipe Loop, Electronics Cooling, Capillary|
|A novel capillary-driven two-phase electronics cooling technology named Heat Pipe Loop (HPL) is being developed . Similar to heat pipes and loop heat pipes (LHP), the HPL operates on the evaporation and condensation of a working fluid and relies on capillary forces in the wick for the fluid circulation. The HPL adopts the advantages of heat pipe and LHP designs while eliminating some of their shortcomings. Unlike in a heat pipe, the liquid and vapor in a HPL flow in separate smooth lines with low pressure drop, which enhances its heat transfer capacity and distance. Unlike in a loop heat pipe, the inexpensive HPL evaporator wick is made in-situ with high thermal conductance non-inverted meniscus. A copper/water HPL prototype was built and tested in ACT. The evaporator had a 1.9cm outer diameter and 7.6cm length. The HPL demonstrated 280W heat transfer capacity over a distance over 76cm with a 50°C heat sink. With a heat flux up to 26.3 W/cm2, the evaporator temperature was 63.6°C, and its wick thermal resistance was 0.25 cm2∙K/W. Cooling performance experiments were conducted at various gravitational orientations and vibration/shock environment to verify the design reliability and robustness.|
|Xudong Tang, R&D Engineer
Advanced Cooling Technologies, Inc.