Here is the abstract you requested from the Thermal_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Pool-Boiling Based Heat Sink Solutions|
|Keywords: pool-boiling / 2-phase, liquid chamber, heat sinks|
|Pool-boiing has long been used to cool high-power components, but in very limited fashion until now. Microporous coating developed by Dr. S.M. You of Univ. of Texas at Arlington had been presented in the past as a potential approach to enabling pool-boiling for a broader market. The presentation will revisit the coating technology, and illustrate how 'liquid chamber' heat sink solutions based on the technology deliver next-generation performance (lowered thermal resistance and increased power handling capability). It will also demonstrate how the heat sinks can be supplied in massive volume by meeting today's price points and addressing many technical challenges such as reliability, manufacturability, handling, and shipping issues that competing technologies often face.|
|Jesse Kim, President & CEO