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Thermal Cycling Stability of High Thermal Conductive Diamondmetal Matrix Composites
Keywords: Diamond MMC, thermal cycling stability, high thermal conductivity
Increasing power density in high-tech electronics calls for effective thermal management with advanced heat spreader and heat sink materials exhibiting high thermal conductivity combined with a low and customisable coefficient of thermal expansion (CTE). Diamond metal matrix composites can perfectly meet these properties. The essential key to exploit the potential of this material is an optimized design of homogeneous nanometer-thick interlayers between the matrix and the filler material. Careful selection of the raw material quality and coating the diamonds by carbide forming elements improves the bonding strength between the matrix and the diamond particles as well as the thermal transfer. Besides thermal conductivities up to 600W/mK and a low CTE (<10ppm/K), thermal cycling stability is essential when implementing the material in various applications. Simulated soldering processes were performed to investigate the material behavior. New advanced coating and consolidation techniques like thermal diffusion coating and rapid hot pressing were developed to improve the thermal cycling stability of these excellent heat sink materials. The results were supported by scanning electron microscopy including focused ion beam for preparing micro-cross sections of the interface as well as XRD analysis to identify phase compositions within the interface layers.
Michael Kitzmantel, Student
Vienna University of Technology; Austrian Institute of Technology
Seibersdorf, 2444,

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems