Micross

Abstract Preview

Here is the abstract you requested from the Thermal_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Thermal Characterization of High Power LEDS An Introduction to the Issues
Keywords: LEDs, HiPwr, Thermal
Now that high-power LEDs are becoming more ubiquitous in the illumination marketplace, there is a growing need for thermal measurement standards. While the basic thermal measurement technique is well known and exists in the current industry measurement standards, several key issues must be resolved before meaningful LED measurement standards can be created and used in industry. This presentation attempts to address the key issues and, in some cases, present a possible solution. The main issues are: Defining a Diode Defining a Reference Point Addressing the Forward Voltage Stability problem Correcting for Optical Power Output Developing a Thermal Measurement Procedure Each of these issues is relatively unique to HiPwr LEDs and must be addressed in a manner that can be handled by both the device manufacturers and their customers. Perhaps most important is the generation of and industry thermal measurement standard one that recognizes the obligations of both parties to produce and specify meaningful thermal metrics.
Bernie Siegal, President
Thermal Engineering Associates, Inc.
Santa Clara, CA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems