Abstract Preview

Here is the abstract you requested from the Thermal_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Alkali Silicate Glass Based Hermetic Thermal Coatings
Keywords: harsh environments, thermally conductive coatings, hermeticity
Avionics systems used in military and commercial are typically required to survive in harsh environments that include high temperatures and high humidity. The need for high reliability of these systems drives the continued use of ruggedized packages and packaging methods that are often at odds with system level objectives of reducing cost and the use of leading edge electronics technologies. Thus, the design of these systems requires a balance between cost, reliability and performance targeted at particular applications. This presentation will describe development work on a novel material that has been developed by Rockwell Collins to address the need for low cost electronics components suitable for the harsh environments encountered by avionics systems. The material is based on formulations of alkali silicate glass that have been tailored for electronics applications through the integration of nano- and micro-particles. Two particular families of formulations will be discussed in the presentation. One family forms extremely thin glass coatings that provide hermetic or near-hermetic protection when applied to electronics components. The other family of materials is includes high thermal conductivity particles such as diamond to produce a thermally conductive, as well as moisture protective, encapsulant for electronics devices. Both families of materials are processed at temperatures of 160C or less, but once cured are stable up to temperatures as high as ~700C. This paper will provide an overview of the materials and present test data regarding their effects on component reliability and thermal resistance.
Ross Wilcoxon, Principal Mechanical Engineer
Rockwell Collins
Cedar Rapids, IA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic