Abstract Preview

Here is the abstract you requested from the Thermal_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Thermal Challenges and Requirements in Designing for Telco/Telcom Equipment in the NEBS Environment
Keywords: NEBS, network equipment, telco/telcom
In this proposed presentation, we like to differentiate the equipments for Telecom Central Office (CO) environment per NEBS GR-63-Core standard to the more industry dominant, and more familiar, Datacenter (DC) environment. A holistic examination from network equipment design to the Telcom CO requirements will be stepped through in explaining the thermal challenges and requirements along the way. With computer servers’ exponential growth in power for a 7’ rack density from sub-10kW of yester-years, to 30kW in the last half decade, to now product launches of over 60kW, there is significant desire and product research by datacenter cooling equipment vendors as well as computer server equipment vendors in re-introducing liquid-cooling solutions in various forms, such as direct equipment level or providing air-to-liquid heat-exchanging at the rack. This presentation will also examine the hurdles and opportunities in applying these types of solutions in network equipment and the CO environment. This presentation will center on the following areas: • Growth trend of the global population continuing getting on the internet; • Network equipment cooling design constraints o Equipments for CO (SP customers) and DC; o The old mainframe computer term RAS; o Product life for the 2 different industry environments; o Other areas such as acoustics, fan power consumption, and airflow distribution; • Typical CO environments- review GR-63-Core and GR-3028-Core; • Customer perspectives.
Herman Chu, Principal Engineer
Cisco Systems
San Jose, CA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic