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Comparison of Temperature Cycling Behavior of Power Substrates Based on Different Advanced Joining Technologies and Substrate Materials
Keywords: ceramic substrates, reliability, power module substrate
Metal ceramic composite substrates provide electrical insulation, mechanical fixation as well as the primary thermal path for state of the art power modules. Existing substrate technologies including Zr doped alumina, aluminium/AlN (DAB/AMB) as well as silicon nitride and aluminium nitride substrates will be reviewed, both for both active metal braze and direct bonding technologies. Samples were subjected to extensive passive thermal cycling up to 3000 cycles of -40 / 150C and the results will be compared and benchmarked to the relevant failure models. The effect of stress relief patterns will be contrasted. An economic benchmark will highlight the cost-benefit ratio from using advanced substrate technologies.
Alexander Roth,
Fraunhofer IISB
Nuremberg, Bayern 90443,

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic