Here is the abstract you requested from the Thermal_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Comparison of Temperature Cycling Behavior of Power Substrates Based on Different Advanced Joining Technologies and Substrate Materials|
|Keywords: ceramic substrates, reliability, power module substrate|
|Metal ceramic composite substrates provide electrical insulation, mechanical fixation as well as the primary thermal path for state of the art power modules. Existing substrate technologies including Zr doped alumina, aluminium/AlN (DAB/AMB) as well as silicon nitride and aluminium nitride substrates will be reviewed, both for both active metal braze and direct bonding technologies. Samples were subjected to extensive passive thermal cycling up to 3000 cycles of -40° / 150°C and the results will be compared and benchmarked to the relevant failure models. The effect of stress relief patterns will be contrasted. An economic benchmark will highlight the cost-benefit ratio from using advanced substrate technologies.|
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