Here is the abstract you requested from the Thermal_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Advanced IGBT Module Packaging and Thermal Concepts for HEV Powertrains|
|Keywords: power module substrate, double sided cooling, cooling concept|
|Current HEV Modules are currently still very much adhering to the conventional power module paradigm and architecture of the classic power module stack, consisting of baseplate, substrate, die. Current technical innovations like silver sintering (LTJT) concentrate on improving technologies still used in that framework. However new module concept prove significant advantages over the classic approach both regarding the bill of material as well as thermal perfomance and space requirements. New approaches regarding double sided cooling as well as single sided direct cooling will be presented and discussed. Reliability data as well as thermal performance will be benchmarket to standard modules.|
Nuremberg, Bayern 90443,