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A Scalable Thermal Management Architecture for Energy Efficient Containerized Data Center Cooling
Keywords: containerized data center, thermal management, scalable
Escalating data center capital and operating costs are currently under intense scrutiny. A major element in these costs is the thermal management of computers and communications equipment. However, the continuing trends towards increasing server density and power make the thermal management problem more difficult and costly using conventional cooling approaches. It is not often recognized that a primary cause of data center cooling energy inefficiency is the high theral resistance of conventional cooling approaches at the microcircuit level. In this paper we describe an advanced cooling architecture that is both very high performance at the chip level and scalable from the box to the data center levels. This cooling approach, which is currently being employed to cool commercial industral control equipment, can resut in data center PUEs( Power Usage Efficiencies) below 1.2 and can be applied to shipping-container data center units and warehouse-scale computing installations as well as conventional data center layouts.
Joe Marsala, President, Founder
Thermal Form & Function Inc.
Manchester, MA


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