Here is the abstract you requested from the Thermal_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Cooling for IGBTs in Small Channels Based on Velocity and Length Using Common Cooling Liquid|
|Keywords: Liquid cooling, Small channel velocity, Common liquids|
|More real world system designs are demanding powers level and heat flux densities that air cooling does not have the physical ability to reach. Air cannot remove the heat being rejected in the required system volume. Although available for many years liquid cooling is becoming accepted in markets that rejected it just a few years ago. Power supplies, UPS systems, medical electronics and motor drives are just a few examples. This presentation will address a number of common questions regarding what amount of cooling can be achieved using available small channel copper cooling tubes. Both round and rectangular parts will be examined for: 1.) Determining heat transfer coefficient “h” and pressure drop at bulk liquid velocities. 2.) Individual component resistances in moving heat from mounting surface to cooling liquid 3.) Effects of internal finned surfaces versus flat surfaces 4.) Thickness of the boundary layer and relationship to extended fin surfaces in closed channel flow. 5.) Fin efficiency for very thin copper fins. These results will be presented based on different cooling liquids; water vs. Ethylene / Propylene Glycol vs. 50/50 mix.|
|Christopher A. Soule, Director of Engineering