Abstract Preview

Here is the abstract you requested from the Thermal_2009_SC technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Surface Roughness Effects on Boiling Heat Transfer
Keywords: Boiling, Surface Roughness, Microchannel
Boiling heat transfer is an attractive alternative as a next generation cooling technology for high performance electronics due to the high rates of heat transfer obtainable with this approach. However, nucleate boiling heat transfer coefficients are strongly influenced by the nature of the surface conditions and fluid wettability, often hampering an engineer’s ability to obtain accurate heat transfer predictions. In this presentation, an experimental study of surface roughness effects on pool boiling heat transfer and flow boiling heat transfer in microchannels will be discussed. Pool boiling results were obtained from five test surfaces with a roughness average ranging from 0.027 to 10.0 microns. Tests were conducted using two fluids with significantly different thermophysical properties and wetting characteristics: water and FC-77, a perfluorinated dielectric liquid. Notable differences in the boiling behavior between the two fluids on the same set of surfaces were observed. Three microchannel test pieces with a roughness average varying from 1.4 to 6.7 microns were fabricated. Heat transfer and pressure drop results were obtained to assess the influence of surface roughness on flow boiling in microchannels. Surface roughness was found to have a significant influence on the flow boiling heat transfer and pressure drop.
Benjamin J. Jones, Graduate Student
Purdue University
West Lafayette, IN

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems