Here is the abstract you requested from the Wirebond_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Perfection Through Inspection: The Way to Zero-Defect Production of Wire Bonds|
|Keywords: Zero Defect Production, Automatic Optical Inspection, Wire Bonding|
|Zero-Defect Production is becoming a key strategy in electronics manufacturing because of higher product quality and a number of corollary advantages such as better overall process control and sharply reduced manufacturing complexity. Automatic Optical Inspection systems are widely used to achieve 100% inspection of production volume. Their standard working principle is comparing the image of an ideal part to the part under inspection and accepting or rejecting it if the image correspondence is below a certain, definable threshold. Overall these systems operate very similar to classical visual inspection. The real strength of automatic inspection systems can, however, be exploited only when images are not just compared but quantitatively evaluated. In this fashion, numerical parameters of interest to the wire bonding engineer can be extracted from wire bond pictures, such as the position of the bond foot on the bond pad; the width, length, deformation and symmetry of the bond foot; loop length, loop shape and even loop height. With numerical values in hand, they can be compared against pre-set thresholds and used to reject defective parts. Even more interesting is the capacity to run a full SPC. In this way the actual mean values and standard deviations, i.e. the process capability, is accessible in a very simple and economic fashion for 100% of production volume without any penalty in throughput because the inspection systems can run fully parallel to the wire bonder. This permits spotting any adverse trends and counteracting long before a defect occurs. F&K Delvotec has developed a PBI (post-bond inspection) system which is specifically designed for die-bonding and wire-bonding. Its scope and possible utilization is discussed in detail in this paper, as are several further potential developments from this approach.|
|Josef Sedlmair, Technical Consultant
F&K Delvotec Bondtechnik GmbH
Ottobrunn, Munich 85521,