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Characterization and Calibration of the Ultrasonic System of U/S Wire and Flip-Chip Die Bonders
Keywords: Ultrasonic system, Characterization, Calibration
For more than half a century ultrasonic technology has been used in wire bonding and also for a long time in u/s flip-chip die bonding. Despite this fact a lot of operators of bonders and service staff know only little about the core part – the heart - of the bonder. Little or no easy-to-use measurement equipment was available to apply to bonders. Therefore the correct setting up of the ultrasonic system requires long experienced technicians and seems like black magic for many people. One basic requirement in production is good and consistent bondability form machine to machine. A test and measurement procedure to characterize and to calibrate the output of the ultrasonic system is essential to achieve this goal. Other important tasks are diagnosis of the ultrasonic system and to pin-point the problematical area in case of problems with the ultrasonic system, quality income control for spare parts (transducers & bonding tools), process research and last but not least training and education of operators and technicians. This paper gives an introduction into some ultrasonic transducer basics, new developed equipment to measure mechanical and electrical characteristics of the ultrasonic system and describes a procedure to calibrate the ultrasonic system of wire bonders based at displacement measurements.
Mike Klling, General Manager
F&K Physiktechnik GmbH
Potsdam D-14482,

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