Micross

Abstract Preview

Here is the abstract you requested from the Wirebond_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Odd Form Factor Package Wire Bonding Case Studies
Keywords: Wire Bond, RF Package, Automotive Package
Although there is continued effort in the semiconductor packaging industry to reduce package size along with the never ending pursuit of cost savings, there remain a significant number of applications which require a wildly different set of capabilities for wire bonding. This paper will explore the wire bonding requirements of several device cases that could be considered odd form factor package formats when compared to mainstream semiconductor packaging. Example cases are presented to show the challenges and solutions to bond packages in the RF, Automotive, and Optical markets with large form factor (12inch x 6inch), deep reach (0.535 inch), leads, pins, and other challenges.
Daniel D. Evans, Jr., Sr. Scientist / Applications Manager
Palomar Technologies
Carlsbad, CA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems