Here is the abstract you requested from the Wirebond_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Wire Bond Integrity Versus Surface Finish of Aluminum Clad Substrates|
|Keywords: Wire, Bond, Integrity|
|As aluminum wire bonding continues to grow as a means of producing strong, reliable interconnects for the electronics industry, one of the concerns that continues to be discussed is the surface finish of leadframe bond pads. Great care is taken during the manufacturing process of these aluminum inlay clad products, as well as during the subsequent stamping and molding processes, however, this soft aluminum surface is still prone to surface imperfections. Quantifying how a single point defect, or surface roughness (Ra), effects wire bond integrity continues to be a subject of interest. This study will evaluate a range of different aluminum inlay surface finishes and also different size and shape of single point defects. The test coupons for this study will be standard production material with an inlay thickness of .002” aluminum bonded to a leadframe base material of C19400 copper alloy. Bonding will be done using 6 mil., 10 mil., and 15 mil. aluminum wire using standard Orthodyne settings. The performance of these bonds will then be evaluated by pull testing, shear testing and a visual analysis of the bond footprint after shearing.|
|Barry Njoes, Sr. Applications Engineer
Technical Materials Inc.