Here is the abstract you requested from the Wirebond_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Practical Considerations for PowerRibbon® Bonding of Hybrid Packages|
|Keywords: ribbon, hybrid, power module|
|This paper is an overview of methods and factors for design, implementation, and control of PowerRibbon® bond processes. Topics include: package optimization, bond layout and bond pad design, ribbon and bondtool selection, looping, process metrics, minimizing variation, and productivity.|
|Richard Elliott, Technical Marketing Specialist