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Practical Considerations for PowerRibbon® Bonding of Hybrid Packages
Keywords: ribbon, hybrid, power module
This paper is an overview of methods and factors for design, implementation, and control of PowerRibbon® bond processes. Topics include: package optimization, bond layout and bond pad design, ribbon and bondtool selection, looping, process metrics, minimizing variation, and productivity.
Richard Elliott, Technical Marketing Specialist
Orthodyne Electronics
Irvine, CA


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