Abstract Preview

Here is the abstract you requested from the Wirebond_2009 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Inert Environment Requirements for Copper Ball Bonding
Keywords: copper, bonding, inert
Copper ball bonding experiments were conducted in a controlled sealed environment establishing tolerable oxygen levels to preclude the formation of bond-preventing oxides on the free-air-ball. With this benchmark in hand, computational fluid dynamics analysis was conducted to determine the requirements of forming gas delivery systems. Copper ball bonding using these kits was performed and correlated with the analysis. The findings are reported in this presentation.
Bob Chylak, VP Process Engineering
Kulicke & Soffa
Ft . Washington, PA

  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems