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Sub-70 um Dispensable Inteconnects for 3D System-In-Package Assemblies
Keywords: 3D Interconnects, SIP, Fine Particle Ink
As the industry implements 3D Integration, the push to smaller pitches will be driven by the demand for I/O and P/G compatibility. At the same time, the market wants a time to market less than or equal to 6 months. To meet these market factors, the most reasonable approach is to adopt current assembly and packaging approaches with process modifications directed to minimize line and space dimensions. One demonstrated technology is that of dispensable 3D Interconnects using hybrid jetting techniques. That technology has been further extended to sub-70 um pitches by adopting aerosol jetting techniques. The benefits of these dispensable 3D interconnects are the minimum length of metallization, reduction in the inductance, minimum stress on the assembled stacks while not taking valuable Silicon real estate. This paper will review this aerosol jetting technology for 3D Integration. Control of the line quality including line height, width, and line edge roughness is possible with relative atomization flows and pressures leading to Cpk well over 1. Ink interactions will be studied including ink temperature and viscosity effects. Finally, the technology has also been scaled up to high volume manufacturing and results will be reviewed.
Suzette K. Pangrle, Principal Scientist
Vertical Circuits, Inc.
Scotts Valley, CA

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