Here is the abstract you requested from the AIT_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Printing Conductive Traces using Nano Silver-Based Inks|
|Keywords: Conductive Inks, Printed Electronics, Electronic Packaging|
|Electronic manufacturers are continually striving to decrease costs and increase functionality of electronic devices and components. Directly printing electronic circuitry onto low-cost substrates, or onto packages, is proving to be an excellent technique for high speed, low cost manufacturing of circuits and devices and is rapidly growing into a multi-billion dollar industry. However, the growth of this industry depends on the availability of suitable inks. In this paper we present details of a new family of nano silver-based conductive inks that NanoMas has developed for the printed electronics industry, and detail the use of these inks in several applications. The inks that we have developed are based on 5nm silver particles that we manufacture. The particles are fabricated using a low cost, readily scalable, wet chemistry process. The small size of the particles results in the inks exhibiting sintering temperatures below 100˚C, facilitating the printing of conductive traces on most common polymer substrates. Using these particles we have fabricated inks for a wide range of printing techniques including ink-jet, gravure, and screen, and aerosol printing. After sintering the printed materials exhibit resistivities as low as 2-5µOhm.cm. In this presentation we describe the use of our silver-base inks to fabricate conductive traces for packaging and flex-circuit applications. In particular we will detail the use of nano silver -based inks to fabricate high density three-dimensional interconnect solutions using aerosol printing. We also describe the use of the formulated inks to fabricate conductive traces several microns thick using ink-jet printing. For both of these applications we demonstrate that using low sintering temperatures the printed traces exhibited the required low electrical resistivities and high adhesion to a variety of substrate materials, and that the processes deliver the high throughput, and narrow trace widths and controlled thicknesses that printed electronics require.|
|David Van Heerden, Principal Applications Engineer
Endicott , NY