Here is the abstract you requested from the AIT_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Aerosol Jet® Printer as an Alternative to Wire Bond and TSV Technology for 3D Interconnect Applications|
|Keywords: 3D Interconnects, Printed Electronics, Wire Bond Replacement|
|Optomec's Aerosol Jet print platform provides an evolutionary alternative to both wire bond and TSV technology, providing a high density 3-dimensional interconnect solution that enables multi-functional integrated circuits to be stacked and vertically interconnected in high performance Multi-Chip Packages (MCP's). The die stacks can include up to 8 die, with a total stack height below 1 mm. The printing system has a working distance of several mm which means that no Z-height adjustments are required for the interconnect printing. Closely coupled pneumatic atomizers with multiplexed print nozzles are used to achieve production throughputs of greater than two interconnects per second per nozzle. The Aerosol Jet deposits silver nanoparticle ink connections on staggered multi-chip die stacks. High aspect ratio interconnects with <30-micron line width and 6-micron line heights have been demonstrated at sub 75-micron pitches with resistivity <1x10^-7 ohm*m. Pre-production yields exceeding 80% have been consistently realized. This paper will be further expanded to include final production packaging and results of the fully integrated Aerosol Jet print platform.|
|Michael O'Reilly, Product Management