Abstract Preview

Here is the abstract you requested from the AIT_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Keynote Presentation: Future Interconnect Demands for High Performance Computing
Keywords: Interconnect , Advanced Packaging Technologies , Signal and Power Integrity
This presentation focuses on technology requirements and design challenges of the wide variety of interconnect requirements in next generation of super computing systems. Within a modern massively parallel supercomputer, there are kilometers of interconnections comprised of micron length interconnects within chips all the way to multi-meter length PCB traces/cables for rack to rack and cabinet to cabinet communications. Scaling of metal based interconnects at all levels, new material and advanced packaging technologies are being deployed to provide higher system performance while maintaining constant bandwidth-distance products. However, signal and power integrity issues such as signal transmission loss, crosstalk and low noise, low voltage power delivery requirements as well as the need to reduce system power consumption, posting daunting challenges in the next generation of supercomputer development. Recent advances in emerging interconnect technologies such as 3D packaging, Z-interconnects and optical interconnects will be discussed in the context of improving performance and power consumption of future supercomputing systems.
How T. Lin, Chief Scientist / Systems Architect
Endicott Interconnect Technologies, Inc.
Endicott, NY

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems
  • Technic