Abstract Preview

Here is the abstract you requested from the IMAPS_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Improved Design of a High Density 3D Multichip Module for Class I Medical Devices
Keywords: 3D multichipmodule, reliability, high density
Today's sophisticated DSP based hearing instruments demand high density microelectronic packaging solutions. This demand in turn drives innovation and collaboration among design and manufacturing personnel and suppliers. The challenge is to design a miniature microelectronic package that provides years of reliable operation within the damp and corrosive environment surrounding the human ear canal. New problems arise as we probe beyond conventional design and process spaces. Rapid reliability testing, failure analysis, and root cause identification are essential in this global, fast-paced development arena. Within this arena Starkey developed a novel 3D multichip BGA module for attachment onto a flexible, high density substrate that is then folded and assembled into a hearing instrument. This paper describes the module and outlines the test protocol, test results, and the challenges faced by the design team during the development process. The challenges included understanding and overcoming the causes of electromigration and delamination failure mechanisms. The tools and techniques of failure analysis are described along with problem resolution. X-ray photoelectron spectroscopy (XPS), scanning electron microscopy (SEM), and finite element analysis (FEA) are several of the more sophisticated analytical tools that were necessary to achieve rapid root cause analysis and corrective action. Finally, a summary of the lessons learned from this development experience is provided. Key Words: chip-on-flip-chip multichip module, high density flexible substrate, electromigration, delamination, X-ray photoelectron spectroscopy (XPS), scanning electron microscopy (SEM), finite element analysis (FEA).
Doug Link, R&D Packaging Engineer
Starkey Labs
Eden Prairie, MN

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic