Micross

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Custom Test Fixture Design and Measurement Correlation of Differential Pairs in a Flip-Chip Organic Buildup Package Using Measurement Based De-Embedding
Keywords: Signal Integrity, de-embedding, package
The modeling of a flip-chip organic buildup package and the resulting measurement correlation are presented. The design of a custom test fixture and procedures to measure the 4-port S-Parameters of a flip-chip substrate using 4-port network analyzer and fixture de-embedding is presented. The probes and SMA to microstrip launches are removed using measurement based de-embedding through adapter characterization removal. Residual error of de-embedding is presented along with correlation of the model with the measurement.
Daniel Lambalot, Director of Engineering
Bayside Design, Inc.
Milpitas, CA
USA


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