Here is the abstract you requested from the IMAPS_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Custom Test Fixture Design and Measurement Correlation of Differential Pairs in a Flip-Chip Organic Buildup Package Using Measurement Based De-Embedding|
|Keywords: Signal Integrity, de-embedding, package|
|The modeling of a flip-chip organic buildup package and the resulting measurement correlation are presented. The design of a custom test fixture and procedures to measure the 4-port S-Parameters of a flip-chip substrate using 4-port network analyzer and fixture de-embedding is presented. The probes and SMA to microstrip launches are removed using measurement based de-embedding through adapter characterization removal. Residual error of de-embedding is presented along with correlation of the model with the measurement.|
|Daniel Lambalot, Director of Engineering
Bayside Design, Inc.