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A Miniaturized Ground Surface Perturbation Lattice for Noise/Coupling Mitigation in Packaging Applications
Keywords: Noise mitigation, GSPL, EBG
As microprocessor and ASIC power supply voltages are headed to 2.0V and below and clock frequencies go up, the power distribution system of IC packages is becoming an increasingly important design challenge. In high-end flip-chip and ball-grid array (BGA) packages, multiple power and ground planes are used to keep power supply noise low. The present paper investigates a model and application of a miniaturized ground surface perturbation lattice (GSPL) for noise/coupling mitigation in packaging applications. The model consists in a 2x2cm power bus with three dimensional (3D) EBG structures, circular patches and four vias located at the edge of the circular pad. In order to reduce the manufacturing cost, through vias are used. The model is validated by comparison with measured data available in literature, utilizing multiple solvers and evaluating the dispersion diagram of the corresponding unit cell. A sensitivity analysis of the bandgap region with respect to the pad's radius of the circular patch, height as well as via radius is performed. It is found that the aforementioned parameters allow shifting the band gap generated in the noise coefficients and therefore to design the power bus according to desired specifications. Results will be provided in both time domain (timing analysis and amplitude of coupled signals) as well as frequency domain (S-parameters). The signal integrity (SI) will be finally investigated (in terms of S-parameters and eye diagram) by considering a line routed from top to bottom layer and comparing the GSPL structure with a standard power bus structure. Because of the absence of etched PWR/GND layer, it will be demonstrated how the GSPL represents a viable solution for the noise mitigation in packaging applications. Furthermore the scalability of the GSPL structure allows extending it to even more compact substrate SiP/SoP types.
Antonio Ciccomancini Scogna, Principal Engineer
CST of America
Framingham, MA
USA


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