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Packaging in IBIS AMI Technology
Keywords: AMI, Packaging, Simulation
As serial links become faster and more complex, it is ever more challenging to model the silicon in an accurate an efficient manner. IBIS AMI is a promising standard that is able to accurately model drivers and receivers including equalization and CDR circuits. One critical unaddressed aspect of the AMI model is the standardization on packaging and IC front end analog models. Traditional IBIS package models are simply not accurate enough and lack the bandwidth for high-speed serial channels. Scattering parameters are a common way of including the effects of the package and IC but there is currently no standard format of pairing these with AMI models and different corner cases. In this paper we will present the current AMI standard including packaging and how it compares and contrasts with previous simulation techniques. A design kit for IBM's CU045 core technology will be discussed that enables a corner case analysis of different Tx/Rx packaging and IC variations. Scattering parameters for different packages and IC models will be included in the linear channel and the AMI device front end. The different models may be included and removed from the channel simulation by changing a variable to the appropriate corner type. This channel study is intended to serve as an example of how the eventual adoption of high bandwidth IBIS AMI package and IC models should work. Eye diagrams, BER and frequency domain results will be shown to demonstrate the importance of the analog front end. Results will be compared to IBM's HSSCDR. Chris Herrick left Ansoft for Apple in July 2010 per Dale Becker. New author information submitted 8-11-10 by Dale Becker.
Daniel Dvorscak, Engineer
ANSYS, Inc.
Burlington, MA
USA


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