Here is the abstract you requested from the IMAPS_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Wafer Level Package with Y Shaped TSV and Vacuum Sealing by Cu-Sn Isothermal Solidification for MEMS Resonator|
|Keywords: MEMS, WLP with TSV, vacuum packaging|
|A novel WL- CSP structure for MEMS device is proposed. Key features are: "Y-shaped" TSV is fabricated to reduce cost; Cu-Sn isothermal solidification is used to achieve lower temperature bonding; I/O interconnection and vacuum sealing are achieved simultaneously simplifying the whole process.|
|Le Luo, Professor
Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences