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Wafer Level Package with Y Shaped TSV and Vacuum Sealing by Cu-Sn Isothermal Solidification for MEMS Resonator
Keywords: MEMS, WLP with TSV, vacuum packaging
A novel WL- CSP structure for MEMS device is proposed. Key features are: "Y-shaped" TSV is fabricated to reduce cost; Cu-Sn isothermal solidification is used to achieve lower temperature bonding; I/O interconnection and vacuum sealing are achieved simultaneously simplifying the whole process.
Le Luo, Professor
Shanghai Institute of Microsystem and Information Technology, Chinese Academy of Sciences
Shanghai 200050,
China


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