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Correlation of Dispense Characteristics of Conductive Inks to Substrate Temperature
Keywords: Dispensing, Flexible substrates, Conductive inks and pastes
With the increase in demand for smaller and low cost printed electronics, it becomes necessary to constantly evaluate different materials and processes. Dispensing technology is widely used to form interconnections and complete circuits especially on flexible substrates. In this study various conductive inks and pastes are evaluated to form fine features by dispensing onto different substrate materials. The effect of substrate properties such as surface energy and dispense environment on the line-width, height and slump or spread of the dispensed material is also investigated. The data derived from this study will help categorize flexible substrate materials and also determine the most suitable substrate-conductive material combination. Key points of the study include: • Evaluate effect of substrate surface energy on width of dispensed structures. • Evaluate effect of substrate temperature on width of dispensed structures. • Evaluate effect of viscosity and material properties of inks/pastes on width of dispensed structures. • Develop mathematical equation for correlating substrate temperature, surface energy, ink viscosity and width of dispensed structures.
Fred Haring, Fabrication Technician
North Dakota State University - Center for Nanoscale Science and Engineering
Fargo, ND
USA


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