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Fine Feature Solder Paste Printing for Solder Sphere and Solder Trace Manufacturing
Keywords: Solder paste printing, Solder ball formation, Process reproducibility
Printing solder paste for solder ball formation is used as a method of making interconnects for flip chips and other devices in the semiconductor industry. Solder paste printing is an economical approach for manufacturing solder spheres for use in research and development facilities or in instances where custom size spheres are needed. Other instances where solder sphere printing may be used include custom alloy formulations that are not current market products. The printing study was designed to evaluate printing characteristics of a type 6 commercially available solder paste. As electronic devices become smaller and interconnection methods and space and trace requirements become higher due to shrinking designs and higher inputs/outputs, it has become necessary to be able to print smaller features with closer spacing requirements. By evaluating and characterizing the process of printing specific solder paste features to formulate solder spheres and traces, spatial requirements for printing these features can be determined. The effect of substrate surface energy on solder sphere size will also be investigated for the custom solder sphere manufacturing Key points of the study include: • Illustrating the reproducibility and repeatability of the solder sphere manufacturing process • Developing print size, spacing, and line width capabilities • Flux bridging and paste bridging of prints per size and spacing of printed features • Comparison of printed features to stencil design • Bridging of solder spheres and lines after reflow per size and spacing of printed features • The study of the effect of substrate surface energy
Fred Haring, Fabrication Technician
North Dakota State University
Fargo, ND

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