Here is the abstract you requested from the IMAPS_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Metal Coated Polymer Particles for Electronic Packaging|
|Keywords: ACA, Electroless nickel, Electroless gold|
|Miniaturization and robustness are key factors in the design and manufacturing of electronic devices. Anisotropic conductive adhesives (ACA) conduct electricity along only one direction and are increasingly used in electronic applications. When replacing soldering pastes and other traditional methods they offer a more efficient use of the boards as well as more flexible and reliable interconnects. Typical ACA pastes contain electrically conductive particles, in the size range 2 to 10 micrometers, incorporated in an insulating binder. When used as conductive filler, metal coated polymer spheres offer a lower use of metal and a larger bonding surface due to their deformability. We describe a novel method to encapsulate polymer spheres within metallic shells and discuss the parameters influencing the deposition of the metal. By optimizing the coating process polymer spheres with different sizes and surface functionalities were successfully coated with nickel and gold. Particle properties as measured from single particle compression testing will be presented as well.|
|Dan Goia, Professor