Here is the abstract you requested from the IMAPS_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Successful Practices for the Modeling of Printed Circuit Boards and Substrates Using Electromagnetic Field Solvers|
|Keywords: Signal and power integrity modeling, Electromagnetic field solvers, Measurement and simulation correlation techniques|
|This work is aimed at providing strategies to create models of printed circuit boards (PCBs) and substrates using electromagnetic field solvers. It will provide strategies on how to determine the correct field solver for model creation considering full-wave, quasi-static, modal decomposition, finite element and boundary element methods. Tradeoffs between time and accuracy of the different solvers will be discussed. Model creation for use in time domain simulators will be the focus, but analysis of the frequency domain data will be used to correlate measurement to simulation. Correlation techniques between simulation and measurement will be discussed because validation between models requires precise setup and interpretation of the setups. The physical layer reference design boards are designed to provide a set of structures to identify parameters of low-cost FR-4 dielectrics, high performance laminates, and to benchmark electromagnetic analysis software with measurements. Transmission line segments and resonant structures are used to identify dielectric properties. Typical elements of single-ended and differential multi-gigabit data channels and some pedagogical structures are added to benchmark electromagnetic or signal-integrity simulators. All test structures are equipped with well optimized launches from SMA and 2.92 mm connectors to microstrip and stripline traces.|
|Steven G. Pytel, Jr., Signal Integrity Product Manager