Here is the abstract you requested from the IMAPS_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Fabrication of Tall Structures for Microelectronics Application Using Selective Electrodeposition Process|
|Keywords: Selective Electrodeposition, LIGA, Bump plating|
|Fabrication of tall features using selective electrodeposition is well know process and has several applications in microelectronics packaging. The use of conventional exposure and development processes is limited by the aspect ratio and sizes of the features obtained. This paper describes a novel approach to fabricated nearly vertical small sized features using thick photoresist JSR THB-151-N. A hot embossing tool made of copper was fabricated using this process which has feature size as small as 50 µm with height of 50 µm. This hot embossing tool was used to fabricate trenches in a polymeric substrate which were filled with an electrically conductive polymer thick film to form electrical interconnects. Also presented are results from experiments performed to fabricate tall silver pillars with nearly vertical walls on bare dies to form interconnects.|
North Dakota State University