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Impact of Mechanical Simulation Methodology on Electronic Package Reliability Assessment with Demonstration on 3D Technologies
Keywords: mechanical, simulation , reliability
Mechanical reliability issues in electronic package have drawn significant attention in semi-conductor industry for decades and have increased product development cost significantly. Recent rapid growth of various portable electronic devices like netbook and smartbook with increasing demand for more functionality in tighter space further challenges the limit of mechanical reliability. To reduce the product development cost and time-to-market, mechanical simulation has been extensively employed across semiconductor industry for the purpose of design optimization and reliability assessment. The importance of having the correct simulation methodology can't be overemphasized considering the extent of its utilization throughout the whole product development cycle. In this paper, we will discuss three fundamental mechanical modeling methodologies that are widely used for flip-chip overmolded packages in the industry. The first approach is to assume whole package is stress-free initially at a given uniform temperature, which is usually the peak temperature of the mold cure profile. However, this differs from the actual assembly process where package composition and reflow or cure temperature profiles are different at each process step. The second approach takes that into account and assigns different initial stress-free temperature to different package component. The last approach explores that idea further by simulating the actual assembly process step by step through element removal and addition techniques in the model. Reliability assessment regarding different failure mechanism based on these three modeling methodology is included with demonstration on 3D technologies. The paper is prepared to the best knowledge of authors. These statements do not reflect opinions from Qualcomm Inc. All data shared in this paper will be screened such that no confidential information is published or presented.
Zhongping Bao,
Qualcomm Inc.
San Diego, CA
USA


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