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High Via Density on Thin Metal Core PCB using Electro Coated Dielectric
Keywords: High Via Density, Metal Core PCB, low thermal coefficient
Conventional printed circuit boards (PCBs) may be replaced by thinner metal-core boards for some applications, as well as for package substrates. Using thin, metal-core technology may provide advantages for radio frequency (RF) circuits and packages, and increase heat dissipation for high power applications. The metal-core technology has several layers including the metal core, electro-coated dielectric, sputtered metal layers, and electroplated copper. Especially for RF application and automotive electronics printed circuit boards with a metal core is gaining interest. The advantage of this metal core PCB is the low thermal coefficient as well as the possibility to achieve a high density of vias and electronic component assembly. This paper describes the realization of metal core PCB with a dense amount of vias and with a low thermal coefficient. The dielectric layer is applied after vias have been formed providing a high density electronics assembly on a double sided PCB using the heat dissipation of a metal core with minimal thermal expansion. After photo chemically etching an array of vias, the metal core can be optionally plated with copper. The insulating dielectric is applied using a highly reliable electro deposited coating. Optional a via to the metal core is formed to provide electrical grounding. The final traces are fabricated on top and through via openings.
Bernd Scholz, Research Engineer
North Dakota State University; Center for Nanoscale Science and Engineering
Fargo, ND
USA


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