Here is the abstract you requested from the IMAPS_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|High Via Density on Thin Metal Core PCB using Electro Coated Dielectric|
|Keywords: High Via Density, Metal Core PCB, low thermal coefficient|
|Conventional printed circuit boards (PCBs) may be replaced by thinner metal-core boards for some applications, as well as for package substrates. Using thin, metal-core technology may provide advantages for radio frequency (RF) circuits and packages, and increase heat dissipation for high power applications. The metal-core technology has several layers including the metal core, electro-coated dielectric, sputtered metal layers, and electroplated copper. Especially for RF application and automotive electronics printed circuit boards with a metal core is gaining interest. The advantage of this metal core PCB is the low thermal coefficient as well as the possibility to achieve a high density of vias and electronic component assembly. This paper describes the realization of metal core PCB with a dense amount of vias and with a low thermal coefficient. The dielectric layer is applied after vias have been formed providing a high density electronics assembly on a double sided PCB using the heat dissipation of a metal core with minimal thermal expansion. After photo chemically etching an array of vias, the metal core can be optionally plated with copper. The insulating dielectric is applied using a highly reliable electro deposited coating. Optional a via to the metal core is formed to provide electrical grounding. The final traces are fabricated on top and through via openings.|
|Bernd Scholz, Research Engineer
North Dakota State University; Center for Nanoscale Science and Engineering