Micross

Abstract Preview

Here is the abstract you requested from the IMAPS_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Low Temperature Direct Bond Technology for 3D Microelectronics Integration and Wafer Scale Packaging
Keywords: 3D integration, Low temperature direct bonding, Scalable 3D interconnect
3D microelectronics integration and wafer scale packaging promise improvements in functional density and cost compared to conventional 2D microelectronics and packaging technologies. The ZiBond™ and DBI® low temperature direct bond technologies developed by Ziptronix have a number of inherent performance and cost advantages compared to other 3D technologies. This paper will describe the ZiBond™ and DBI® technologies and applications that will drive their volume manufacturing adoption.
Paul Enquist, CTO / V.P. R&D
Ziptronix, Inc.
Morrisville, NC
USA


CORPORATE PREMIER MEMBERS
  • Amkor
  • ASE
  • Canon
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • NGK NTK
  • Palomar
  • Plexus
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Specialty Coating Systems