Here is the abstract you requested from the IMAPS_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|3D IC Design and CAD|
|Keywords: 3D-IC, 3DIC, Design|
|3D stacking and integration with TSVs can provide significant system advantages. This tutorial and state-of-the-art review will cover issues related to 3DIC from a designer's perspective. The tutorial will start with a review of the 3DIC technology set, including status and infrastructure for deployment. It then proceeds to applications of 3DIC, including memory-on-logic, and heterogeneous integration. Most of the tutorial focuses on design approaches to creating 3D specific systems, including parititioning, floorplanning, interconnect design, thermal and package design. CAD issues are explored starting with CAD environment we built at NCSU to enable the design of 3DICs. Finally, the tutorial will cover critical issues that are still to be solved include design planning, test management, and thermal management.|
|Paul D. Franzon,
North Carolina State University