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3D IC Design and CAD
Keywords: 3D-IC, 3DIC, Design
3D stacking and integration with TSVs can provide significant system advantages. This tutorial and state-of-the-art review will cover issues related to 3DIC from a designer's perspective. The tutorial will start with a review of the 3DIC technology set, including status and infrastructure for deployment. It then proceeds to applications of 3DIC, including memory-on-logic, and heterogeneous integration. Most of the tutorial focuses on design approaches to creating 3D specific systems, including parititioning, floorplanning, interconnect design, thermal and package design. CAD issues are explored starting with CAD environment we built at NCSU to enable the design of 3DICs. Finally, the tutorial will cover critical issues that are still to be solved include design planning, test management, and thermal management.
Paul D. Franzon,
North Carolina State University
Raleigh, NC

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic