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|2 mils Au Wire Interchip Wedge Bond Cratering Study|
|Keywords: Wedge bond, Cratering, IMC|
|Au wire thermosonic wedge bonding is applied for die to die interconnect on accelerometer device. With the fragile bond pad structure of MEMS device, bond pad cratering or bond pad metal peel is a fatal wedge bond defect during assembly packaging and reliability failure during field application. Typical interchip wedge bond failure modes and the cause of failures are studied through analyzing wedge bonding mechanism, packaging & tooling design and material properties. Comprehensive wedge bond process characterization was carried out to improve wedge bond quality and reliability. Critical wedge bond responses (WDT, wedge pull, wedge shear, Cratering, IMC) were studied during wedge bond process characterization. The pro and con of current wedge bond process is analyzed and alternative approaches to further enhance accelerometer interchip bond integrity are addressed.|
|Wang ZhiJie, Packaging Proecess Engineering Manager