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|Solid-State Formation of Intermetallic Compounds in Co-Sb Coupled Nanowires|
|Keywords: Nanointerconnection, Co and Sb nanowires , Diffusion and phase transformation|
|Nanointerconnection technologies are attracting much attention for the future electrical interconnection in electronic packaging. There are several reports that the metal nanowires can be used for the interconnection. For the nanowire interconnection, it would be favorable to form the intermetallic compounds (IMCs) between the nanowires, in order to effectively reduce the contact resistances of the nanowires. However, there are lacks of studies on the formation of intermetallic compounds in the size of nanowire. In this study, the bi-nanowires of Co and Sb elements are selected to investigate the solid-state reaction of forming the intermetallic compounds between Co and Sb nanowires. The Co-Sb alloys are candidate materials to be used in secondary lithium-ion battery and thermoelectric devices. It is well-known that the intermetallic compounds of CoSb, CoSb2 and CoSb3 are formed between Co and Sb films in solid-state reactions. Generally, when the materials are in nanometer scale, they show exceptional physical properties in comparison with the bulk properties. It is due to the high surface-to-volume ratio and surface relaxation related to the imperfection of coordination number at surface. Here, Co and Sb nanowires were electrochemically deposited within the AAO (anodic aluminum oxide) templates which had the pore diameters of about 20 ~ 60 nm. The formation of intemetallic compounds at the interface between Co and Sb nanowires was investigated with the anneal time at the constant temperature of 773 K. The IMC formation was ascribed to the fast diffusion of Co atoms. The kinetics of solid-state IMC formation and the effects of surface-to-volume ratio on the diffusion are discussed using SEM, XRD, and TEM analyses.|
|Seong Gi Jeon, Student
Korea Advanced Institute of Science and Technology; Department of Materials Science and Engineering