Here is the abstract you requested from the IMAPS_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Effect of Dielectric Selection on the Sintering Behavior of LTCC|
|Keywords: LTCC, Embedded, Capacitor|
|Low Temperature Cofired Ceramic (LTCC) is a versatile ceramic packaging technology. LTCC's functionality and performance can be enhanced with the incorporation of passive devices such as resistors, capacitors, and inductors into the structure of the substrate. This incorporation, which eliminates surface mount solder joints is desirable for improving system reliability and allows for increased package density. Commercially available dielectrics for embedding capacitors into LTCC are limited and the incorporation of such systems into LTCC substrates poses processing challenges related to material compatibility. This paper will review multiple dielectric systems and techniques for embedding capacitors into LTCC as well as present new data related to the cofiring behavior of LTCC and custom dielectrics. The Kansas City Plant is operated and managed by Honeywell Federal Manufacturing & Technologies for the United States Department of Energy under contract No. DE-AC04-01AL66850. Sandia is a multiprogram laboratory operated by Sandia Corporation, a Lockheed Martin Company for the United States Department of Energy's National Nuclear Security Administration under contract DE-AC04-94AL85000.|
|Daniel S. Krueger, Engineer
Honeywell Federal Manufacturing & Technologies
Kansas City, MO