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|Sensor Packaging: New Challenges for New Applications|
|Keywords: Sensors, High temperature, Die access|
|Worldwide an increasing number of sensors are being used for example in the automotive, healthcare, mobile communication and supply chain areas. Advantages of silicon-based sensors are compatibility with CMOS, reliability, small size and reflow compatibility. Sensors pose a range of new packaging challenges. In the paper examples are being discussed and packaging solutions are given. An automotive sensor like a brushless motor sensor needs to operate inside the motor. Therefore, it needs to withstand high operating temperatures. To make sure that the reliability requirements are met, the molding compound and lead frame material need to be selected carefully. The wire-bonding interconnect can be improved by using monometallic bonding or by enforced bond pads. In Vitro Diagnostics (IVD) provides a fast, cheap, and reliable analysis of human body fluids. Because of its compact form and ease of use it can even be applied at people's homes. IVD uses disposable biosensors that are placed in disposable micro fluidic cartridges. A cheap packaging solution is needed with direct die access for the liquid to be analyzed. The packaging process needs to have a low temperature budget to avoid deterioration of the surface chemistry on the sensor die. RFID sensors can be used to check the quality of goods in the supply chain or in a store. For example the quality of fruit can be checked by measuring T, RH, O2, CO2 and C2H4. For fruit like tomatoes and strawberries also mechanical shock is of importance. For products like meat pH and light intensity is to be checked. Format of the RFID sensor is a label that can be stuck to the transportation box or the consumer package. Also it needs to be cheap because it will be disposed off after use. Finally, as for the biosensor, direct die access is needed to measure gases and liquids.|
|Caroline Beelen-Hendrikx, Director Strategy for Package Innovation
Nijmegen, Gelderland 6534 AE,