Here is the abstract you requested from the IMAPS_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Study of Grounding Schemes Utilized in Conformal Shielding Applications|
|Keywords: Shielding, Grounding, Laminate|
|There are many different shielding technologies available for EMI shielding in Radio Frequency (RF) applications. We will examine RFMD's EMI shielding technologies known as MicroShield. MicroShield is a conformal plating process that encapsulates the device with a solid sheet of metal. This novel concept provides improvements in form factor, ease of use and lower cost as compared to traditional shielding approaches. We will compare ground designs within the substrate to determine maximum EMI shield performance. An examination of ground structures, layer grounding, and external ground connections will be analyzed. The test device structure will be comprised of a radiating element on the top surface of the laminate. A thorough look at the advantages and limitations between these different EMI grounding configurations will be discussed. This data will be used to quantify grounding effectiveness which will in turn be used to generate design rules.|
|Scott Morris, Staff Packaging Engineer
RF Micro Devices