Here is the abstract you requested from the IMAPS_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Fine Pitch Copper Wire Bonding - As Good As Gold|
|Keywords: copper wire bonding, extended reliability, high volume manufacturing|
|Fine pitch wire bonding has tradiontally been the domain of gold wires. The significant increase in gold commodity prices has driven a continuous reduction in wire diameters to minimize the impact of the raw materials cost of the wire. This has reached a point now where copper wires are beginning to displace gold wires despite the technical challenges associated with copper wires. The basic challenges like propensity for oxidation, harddness and propensity ofr corrosion can be managed witht the appropriate investment in tooling and infrastructure. Doubts are presisting about yield and reliability. With a very methodical approach to developing the process controls, it can be demonstrated that yields are as good as those for gold despite the fact that copper bonds are not reworkable. Likewise, the typical JEDEC reliability tests can be full filled. Here, an extensive effort has been placed on extended JEDEC testing to demonstrate that with good process control and proper materials choices, test durations of more than 2x can be passed. This excellent performance demonstrate that copper wire bonding can be as good or better than gold wire bonding.|
|Bernd K. Appelt, Dir WW Business Development
Santa Clara, CA