Here is the abstract you requested from the IMAPS_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Advances in High Performance Grease and Low Modulus Adhesives for LEDS|
|Keywords: Adhesive, Grease, Thermal|
|High brightness LEDs are challenged with thermal management issues due to increased power and reduced surface area. This has led to the need for new materials with higher thermal conductivity that can quickly remove the heat from the active layer. High performance thermal interface materials significantly improve the transmission of the heat generated by the system's high power density. Greases generally have higher thermal conductivity than gels or adhesives with similar fillers. Unfortunately, greases typically pump-out and separate during use. Some applications cannot go through a cure profile normally used for non-grease TIMs. Low modulus thermally conductive adhesives offer a solutions to the problems presented to manufacturers of LED systems. LORD has developed “no-pump out” thermal greases and low modulus adhesives with properties that dramatically exceed traditional materials. This innovative technology helps engineers solve complex fundamental thermal management problems.|