Here is the abstract you requested from the IMAPS_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Selected Applications and Processing for Low Temperature Cofired Ceramic|
|Keywords: Low Temperature Cofired Ceramic, Electromagnetic Interference, Processing|
|Low Temperature Cofired Ceramic has proven itself in microelectronics, microsystems (including microfluidic systems), sensors, RF features, and various non-electronic applications. We will discuss selected applications and the processing associated with those applications. We will then focus on our recent work in the area of EMI shielding using full tape thickness features (FTTF) and sidewall metallization. The FTTF is very effective in applications with -150 dB isolation requirements, but presents obvious processing difficulties in full-scale fabrication. The FTTF forms a single continuous solid wall around the volume to be shielded by using sequential punching and feature-filling. We discuss the material incompatibilities and manufacturing considerations that need to be addressed for such structures and show preliminary implementations.|
|Ken Peterson, Engineer
Sandia National Laboratories