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Drop Test Simulation for the Reliability of Laminate Substrate in Module Packages
Keywords: electronic package, drop test simulation, laminate substrate
Reliability of packaged module with laminate substrate has been of a concern, especially the substrate reliability under drop test with severe dynamic load. To reduce the packaging development time and cost, improve the reliability, and better understand the drop test results, FEA (Finite Element Analysis) has been used to simulate the drop test dynamic performance of the module package. The presented study focuses on both static and explicit dynamic 3D drop test modeling to simulate the actual drop tests of the module package. An over-molded package mounted on quality-board undergoes 1500G gravity in the simulations to identify the package weakness or failure locations and to investigate the impacts of potential key factors. The results were fairly correlated to the actual FA (failure analysis) results. The impact of board side defect, such as solder void, was also studied because it is very common to have this kind of defect in assembly.
Yu Gu , Staff Packaging Engineer
RFMD
Greensboro, NC
USA


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