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A First Individual Solder Joint Encapsulant Adhesive
Keywords: Solder joint encapsulant, BGA/CSP, Flip chip, SMT256
In order to eliminate solder joint crack, enhance the reliability and increase throughput with eliminating underfilling process, YINCAE has successfully developed a first individual solder joint encapsulant adhesive for advanced devices assembly such as BGA, CSP, flip chip, etc. The first individual solder joint encapsulant adhesives—SMT256/266 are applied by printing or dipping process onto a substrate or component, SMT256 can remove metal oxide from pads and bumps to allow solder joint formed, then cure with the formation of 3-D polymer network encapsulating each individual solder joint, in-between solder joints there are no adhesives blocking outgassing channel to ensure process yield. After being used in the customer field for a few years, the implementation of SMT256 can improve the process yield, eliminating voids and crack in solder joint, eliminating head-in-pillow issue for large component during lead free reflow process. The results from thermal cycling test indicated that the first failure cycles using SMT256 is high up to 6000 cycles, at least 4000 – 5000 cycles higher than other process. The pull strength is 1.5 times higher than using solder paste plus underfilling process. All reliability data implied encapsulating each individual solder joint is the right direction to move toward. The enforcement mechanism will be discussed in our presentation.
Mary Liu ,
YINCAE Advanced Materials, LLC
Rome, NY

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