Abstract Preview

Here is the abstract you requested from the IMAPS_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Ink-Jetting for Electronic Assembly
Keywords: inkjet, 3D structuring, silver ink
In the electronics industry time to market is an important factor for business success. Inkjetting is one answer to this demand. The German BMBF has funded a three years project FlexJet until end 2009 to explore this option. We will present the project and final results achieved by the consortium: Mühlbauer, Heraeus, VermesTechnik, Epcos, MicroDrop, Infineon, NANOTEST, TU-Berlin and IFAM. The paper will describe the ink jetting process, best in class, the target of the consortium, evaluated inks and nozzles, demonstrators and concurrent FEM simulation. We close with an outlook on possible applications and improvements.
Georg Meyer-Berg , Senior Staff Engineer SiP and KGD
Infineon Technologies
Neubiberg, Bayern 81671,

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic