Abstract Preview

Here is the abstract you requested from the IMAPS_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Imminent needs in Future Developments of Air Cooled Microprocessors Heat Sinks
Keywords: heat sink, microprocessor, cooling
This study reiterates the fact that revolutionary heat sink geometries, materials and overall exponentially higher performing alternatives are continuously and highly needed as applied to the air cooling of a typical computer system microprocessor. Attention was focused on forced convection regimes of operation and from a system level approach. Minor improvements in the performance of air cooled microprocessor heat sinks via typical small design improvements are discussed. Laminar convection and constant heat dissipation were looked at. The CFD simulations exemplified were completed for several power levels and ambient air characterized by a Pr = 0.71. The numerical results presented coincided in large with the experimentally derived documented data. In conclusion, the authors stress the fact that leading-edge alternatives in air-cooled heat removal of such applications are imperiously necessary.
Dr. Virgil C. Ganescu, Dean of Academic Affairs
Harrisburg Area Community College
Harrisburg, PA

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic