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Chip Embedding for Printed Circuit Boards and Subsystems
Keywords: Electrical component embedding, Microprocessors, Printed Circuit boards
Purpose: At the moment there are two trends in embedding technology: On the one hand embedding for modules which are supposed to be assembled onto commodity PCB´s and on the other hand Chip embedding into mother boards. The paper has its main focus on Chip embedding of fine pitch chips with high I/O count into mother Boards. Methodology: For most embedding approaches a RDL (redistribution layer)and a coating of the chip contacts with copper is needed on wafer level. This is carried out due to the high difference in resolution capability and registration accuracy between Semiconducter technology and PCB technology. The so called iBoard approach uses an interposer to simplify the mechanical and electrical connection between chip and PCB. This has a significant positive influence on cost, ease of supply chain, testability and the feasability for chips with fine pitches. The internal qualification showed significant improvements of reliability of embedded components in comparison to surface mounted devices. Because the process uses only standard assembly equipment it is easy to implement into an industrial environment.
Thomas Gottwald, Head of Product Engineering
Schweizer Electronic AG
Schramberg 78713,

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