Abstract Preview

Here is the abstract you requested from the IMAPS_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.

Characterization of Substrate Materials for use in Environment Classification
Keywords: substrates, material properties, use environment classification
With the expansion of the use of sensors in everyday life, especially in medical and security fields, it has become pertinent that a substrate be chosen which is not only compatible with the sensor functionality and its manufacturing flow but also with the use environment of the sensor. Roll-to-roll manufacturability is also an important consideration along with the quality, reliability and cost of the end product. Material advances have provided a wide variety of choices which need to be studied and understood for competitive applications. In this study, results of the evaluation of numerous substrate materials will be presented. This effort will help provide a reference database and comparison to choose a material for a particular application and application environment. Some of the materials characterized are Polyimide, Polyester, Polysulfone, BT, FR-4, PEEK®, PTFE, Mylar, Teslin, etc. Standard ASTM, IPC and JEDEC procedures were followed where possible during the tests. Some of the material properties evaluated are coefficient of thermal expansion, decomposition temperature, glass transition temperature, Young's modulus, maximum stress at failure, hardness, thermal stress by floating the samples in lead free solder at 288°C, surface energy, thermal shock, moisture absorption, and conductor pattern integrity. It is also important to study how the conductors and the way they are deposited fare from one substrate material to the other. Metallization of the polymers will be carried out by various methods (ink dispense, plating, sputtering, direct write, etc) to determine optimal polymer/metallization method combination. The dispensed inks will be subject to tape peel, and stress tests to characterize pattern adhesion to the substrate and its integrity. The study should lead to an understanding of the differences in the material properties and how they impact their application. This would lead to identification of opportunities for material improvement and material classification for intended applications.
Syed Sajid Ahmad, Manager of Engineering Services
North Dakota State University - Center for Nanoscale Science and Engineering
Fargo, ND

  • Amkor
  • ASE
  • Canon
  • Corning
  • EMD Performance Materials
  • Honeywell
  • Indium
  • Kester
  • Kyocera America
  • Master Bond
  • Micro Systems Technologies
  • MRSI
  • Palomar
  • Promex
  • Qualcomm
  • Quik-Pak
  • Raytheon
  • Rochester Electronics
  • Specialty Coating Systems
  • Spectrum Semiconductor Materials
  • Technic