Here is the abstract you requested from the IMAPS_2010 technical program page. This is the original abstract submitted by the author. Any changes to the technical content of the final manuscript published by IMAPS or the presentation that is given during the event is done by the author, not IMAPS.
|Evaluation of PulseForge Tool for Processing Metallic Conductive Inks on Low Temperature Substrates Part II: Screen Inks|
|Keywords: printed electronics, thermal processing, screen-print|
|The authors present the methodology and apparatus for applying Pulsed Light Processing to traditional flake-based silver screen-print pastes and inks in thicknesses of several microns. Pulsed Light Processing (PLP) has gotten increased attention recently as a means for processing silver nanoparticle-based functional inks. Silver nanoparticle inks are well suited for this type of processing, but represent only a small fraction of the functional inks used in printed electronics. Screen-print inks are a greater challenge for PLP because of the deposition thickness, flake morphology, lower specific surface area, and greater thermal mass. Using PLP, conductive ink sheet resistances of <10 milliohms/sq are achieved on PET without traditional oven processing. Relevant PLP parameters are identified, as well as common failure modes of processing silver screen-inks on PET. Parameter corrections for resolving each failure mode are presented. The authors also present Pulsed Light Processing for converting novel CuO-based ink into Cu thin-film.|
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