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Evaluation of PulseForge Tool for Processing Metallic Conductive Inks on Low Temperature Substrates Part II: Screen Inks
Keywords: printed electronics, thermal processing, screen-print
The authors present the methodology and apparatus for applying Pulsed Light Processing to traditional flake-based silver screen-print pastes and inks in thicknesses of several microns. Pulsed Light Processing (PLP) has gotten increased attention recently as a means for processing silver nanoparticle-based functional inks. Silver nanoparticle inks are well suited for this type of processing, but represent only a small fraction of the functional inks used in printed electronics. Screen-print inks are a greater challenge for PLP because of the deposition thickness, flake morphology, lower specific surface area, and greater thermal mass. Using PLP, conductive ink sheet resistances of <10 milliohms/sq are achieved on PET without traditional oven processing. Relevant PLP parameters are identified, as well as common failure modes of processing silver screen-inks on PET. Parameter corrections for resolving each failure mode are presented. The authors also present Pulsed Light Processing for converting novel CuO-based ink into Cu thin-film.
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